Manufacturing method of semiconductor device, semiconductor...

Details Manufacturing method of semiconductor device, semiconductor... Manufacturing method of semiconductor device, semiconductor...

2008-03-25

2008-03-25

Hoang, Quoc (Department: 2818)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S618000, C257S737000, C257SE23021, C257SE23069

Reexamination Certificate

active

07348269

ABSTRACT:
A method for manufacturing a semiconductor device with a bump electrode wherein the bump electrode includes a resin material as a core and at least a top surface covered with a conductive film. The method includes placing the resin material on a substrate on which an electrode terminal is formed by an inkjet method, and forming an interconnecting metal that connects the electrode terminal to a top surface of the resin material.

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