Method for recognizing a pattern of an alignment mark on a...

Details Method for recognizing a pattern of an alignment mark on a... Method for recognizing a pattern of an alignment mark on a...

2008-05-27

2008-05-27

Mehta, Bhavesh M. (Department: 2624)

Image analysis

Applications

Manufacturing or product inspection

C382S287000

Reexamination Certificate

active

07379581

ABSTRACT:
A method for recognizing a pattern of an alignment mark on a wafer includes positioning the wafer on an adjustable wafer stage in an alignment apparatus; capturing images of a key alignment mark by magnifying an alignment mark region of the wafer; deleting image data from a region where the alignment pattern does not exist between the captured images; and extracting an alignment mark pattern by a pattern recognition of the remaining image data after the deletion of the image data. Thus, an alignment failure can be reduced because a particle on the wafer is not mistaken as an alignment mark.

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patent: 6072915 (2000-06-01), Tanaka
patent: 6278957 (2001-08-01), Yasuda et al.
patent: 6295120 (2001-09-01), Miyatake
patent: 1999-0034411 (1999-05-01), None

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