Semiconductor device and method for manufacturing the same

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

Reexamination Certificate

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C257SE21134

Reexamination Certificate

active

07402471

ABSTRACT:
A semiconductor device using a crystalline semiconductor film is manufactured. The crystalline semiconductor film is formed by providing an amorphous silicon film with a catalyst metal for promoting a crystallization thereof and then heated for performing a thermal crystallization, following which the crystallized film is further exposed to a laser light for improving the crystallinity. The concentration of the catalyst metal in the semiconductor film and the location of the region to be added with the catalyst metal are so selected in order that a desired crystallinity and a desired crystal structure such as a vertical crystal growth or lateral crystal growth can be obtained. Further, active elements and driver elements of a circuit substrate for an active matrix type liquid crystal device are formed by such semiconductor devices having a desired crystallinity and crystal structure respectively.

REFERENCES:
patent: 3108914 (1963-10-01), Hoerni
patent: 3389024 (1968-06-01), Schimmer
patent: 3783049 (1974-01-01), Sandera
patent: 3988762 (1976-10-01), Cline et al.
patent: 4068020 (1978-01-01), Reuschel
patent: 4379020 (1983-04-01), Glaeser et al.
patent: 4409724 (1983-10-01), Tasch, Jr. et al.
patent: 4472458 (1984-09-01), Sirinyan et al.
patent: 4746628 (1988-05-01), Takafuji et al.
patent: 4911781 (1990-03-01), Fox et al.
patent: 4959247 (1990-09-01), Moser et al.
patent: 5010033 (1991-04-01), Tokunaga et al.
patent: 5060197 (1991-10-01), Park et al.
patent: 5075259 (1991-12-01), Moran
patent: 5130103 (1992-07-01), Yamagata et al.
patent: 5147826 (1992-09-01), Liu et al.
patent: 5236850 (1993-08-01), Zhang
patent: 5244836 (1993-09-01), Lim
patent: 5254480 (1993-10-01), Tran
patent: 5262350 (1993-11-01), Yamazaki et al.
patent: 5275851 (1994-01-01), Fonash et al.
patent: 5278093 (1994-01-01), Yonehara
patent: 5308998 (1994-05-01), Yamazaki et al.
patent: 5354697 (1994-10-01), Oostra et al.
patent: 5358907 (1994-10-01), Wong
patent: 5387530 (1995-02-01), Doyle et al.
patent: 5397718 (1995-03-01), Furuta et al.
patent: 5403772 (1995-04-01), Zhang et al.
patent: 5426064 (1995-06-01), Zhang et al.
patent: 5453858 (1995-09-01), Yamazaki
patent: 5480811 (1996-01-01), Chiang et al.
patent: 5481121 (1996-01-01), Zhang et al.
patent: 5488000 (1996-01-01), Zhang et al.
patent: 5492843 (1996-02-01), Adachi et al.
patent: 5501989 (1996-03-01), Takayama et al.
patent: 5508532 (1996-04-01), Teramoto
patent: 5508533 (1996-04-01), Takemura
patent: 5529937 (1996-06-01), Zhang et al.
patent: 5531182 (1996-07-01), Yonehara
patent: 5534716 (1996-07-01), Takemura
patent: 5534884 (1996-07-01), Mase et al.
patent: 5543352 (1996-08-01), Ohtani et al.
patent: 5563426 (1996-10-01), Zhang et al.
patent: 5569610 (1996-10-01), Zhang et al.
patent: 5569936 (1996-10-01), Zhang et al.
patent: 5580792 (1996-12-01), Zhang et al.
patent: 5585291 (1996-12-01), Ohtani et al.
patent: 5589694 (1996-12-01), Takayama et al.
patent: 5595923 (1997-01-01), Zhang et al.
patent: 5595944 (1997-01-01), Zhang et al.
patent: 5604360 (1997-02-01), Zhang et al.
patent: 5605846 (1997-02-01), Ohtani et al.
patent: 5606179 (1997-02-01), Yamazaki et al.
patent: 5608232 (1997-03-01), Yamazaki et al.
patent: 5612250 (1997-03-01), Ohtani et al.
patent: 5614426 (1997-03-01), Funada et al.
patent: 5614733 (1997-03-01), Zhang et al.
patent: 5616506 (1997-04-01), Takemura
patent: 5620910 (1997-04-01), Teramoto
patent: 5621224 (1997-04-01), Yamazaki et al.
patent: 5624851 (1997-04-01), Takayama et al.
patent: 5637515 (1997-06-01), Takemura
patent: 5639698 (1997-06-01), Yamazaki et al.
patent: 5643826 (1997-07-01), Ohtani et al.
patent: 5646424 (1997-07-01), Zhang et al.
patent: 5650338 (1997-07-01), Yamazaki et al.
patent: 5654203 (1997-08-01), Ohtani et al.
patent: 5656825 (1997-08-01), Kusumoto et al.
patent: 5663077 (1997-09-01), Adachi et al.
patent: 5677549 (1997-10-01), Takayama et al.
patent: 5696003 (1997-12-01), Makita et al.
patent: 5696386 (1997-12-01), Yamazaki
patent: 5696388 (1997-12-01), Funada et al.
patent: 5700333 (1997-12-01), Yamazaki et al.
patent: 5705829 (1998-01-01), Miyanaga et al.
patent: 5712191 (1998-01-01), Nakajima et al.
patent: 5744824 (1998-04-01), Kousai et al.
patent: 5773327 (1998-06-01), Yamazaki et al.
patent: 5773846 (1998-06-01), Zhang et al.
patent: 5818076 (1998-10-01), Zhang et al.
patent: 5879977 (1999-03-01), Zhang et al.
patent: 5882960 (1999-03-01), Zhang et al.
patent: 5897347 (1999-04-01), Yamazaki et al.
patent: 5913112 (1999-06-01), Yamazaki et al.
patent: 5923962 (1999-07-01), Ohtani et al.
patent: 5942768 (1999-08-01), Zhang
patent: 5956579 (1999-09-01), Yamazaki et al.
patent: 5962870 (1999-10-01), Yamazaki et al.
patent: 5985704 (1999-11-01), Adachi et al.
patent: 6037610 (2000-03-01), Zhang et al.
patent: 6048780 (2000-04-01), Hayakawa
patent: 6060725 (2000-05-01), Zhang et al.
patent: 6110770 (2000-08-01), Zhang et al.
patent: 6140165 (2000-10-01), Zhang et al.
patent: 6171890 (2001-01-01), Adachi et al.
patent: 6211536 (2001-04-01), Zhang
patent: 6261875 (2001-07-01), Zhang et al.
patent: 6285042 (2001-09-01), Ohtani et al.
patent: 6331723 (2001-12-01), Yamazaki et al.
patent: 6335541 (2002-01-01), Ohtani et al.
patent: 6348367 (2002-02-01), Ohtani et al.
patent: 6413805 (2002-07-01), Zhang et al.
patent: 6451638 (2002-09-01), Zhang et al.
patent: 6541313 (2003-04-01), Zhang et al.
patent: 6599359 (2003-07-01), Adachi et al.
patent: 6608325 (2003-08-01), Zhang et al.
patent: 6624445 (2003-09-01), Miyanaga et al.
patent: 6627487 (2003-09-01), Zhang
patent: 6730549 (2004-05-01), Zhang et al.
patent: 6756657 (2004-06-01), Zhang et al.
patent: 6798023 (2004-09-01), Ohtani et al.
patent: 6939749 (2005-09-01), Zhang et al.
patent: 6955954 (2005-10-01), Miyanaga et al.
patent: 6987283 (2006-01-01), Zhang et al.
patent: 6998639 (2006-02-01), Ohtani et al.
patent: 7148094 (2006-12-01), Zhang et al.
patent: 2002/0024047 (2002-02-01), Yamazaki et al.
patent: 61-063017 (1986-04-01), None
patent: 64-045162 (1989-02-01), None
patent: 01-206632 (1989-08-01), None
patent: 02-119122 (1990-05-01), None
patent: 02-140915 (1990-05-01), None
patent: 03-280420 (1991-12-01), None
patent: 05-009090 (1993-01-01), None
patent: 05-114724 (1993-05-01), None
patent: 05-203991 (1993-08-01), None
patent: 05-210364 (1993-08-01), None
patent: 07-176479 (1994-07-01), None
patent: 06-267988 (1994-09-01), None
patent: 06-268212 (1994-09-01), None
patent: 06-318700 (1994-11-01), None
patent: 06-333824 (1994-12-01), None
patent: 06-333825 (1994-12-01), None
patent: 06-349735 (1994-12-01), None
patent: 07-058338 (1995-03-01), None
patent: 07-161634 (1995-06-01), None
patent: 07-235492 (1995-09-01), None
patent: 07-335548 (1995-12-01), None
patent: 08-017741 (1996-01-01), None
R. Kakkad, J. Smith, W.S. Lau, S.J. Fonash, J. Appl. Phys. 65 (5), Mar. 1, 1989, 1989 American Institute of Physics, p. 2069-2072, “Crystallized Si Films By Low-Temperature Rapid Thermal Annealing of Amorphous Silicon”.
G. Liu, S.J. Fonash, Appl. Phys. Lett. 62 (20), May 17, 1993, 1993 American Institute of Physics, p. 2554-2556, “Polycrystalline Silicon Thin Film Transistors on Corning 7059 Glass substrates Using Short Time, Low Temperature Processing”.
G. Liu and S.J. Fonash, Appl. Phys. Lett. 55 (7), Aug. 14, 1989, 1989 American Institute of Physics, p. 660-662, “Selective Area Crystallization of Amorphous Silicon Films by Low-Temperature Rapid Thermal Annealing”.
R. Kakkad, G. Liu, S.J. Fonash, Journal of Non-Crystalline Solids, vol. 115, (1989), p. 66-68, “Low Temperature Selective Crystallization of Amorphous Silicon”.
S. Caune et al., Appl. Surf. Sci., 36 (1989), “Combined CW laser and furnace annealing of a-Si and Ge in contact with some metals”, pp. 597-604.
C. Hayzelden et al., “In SituTransmission Electron Microscopy Studies of Silicide-Mediated Crystallization of Amorphous Silicon” (3 pages).
S. P. Murarka, “Silicides for VLSI Applications”, p. 112, 82, no date.
T. Hempel et al., Solid State Communications, vol. 85, No. 11 (1993) pp. 921-924

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