Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate
2008-03-25
2008-03-25
Nguyen, Tuan H. (Department: 2813)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
C257S735000
Reexamination Certificate
active
07348659
ABSTRACT:
A semiconductor chip is mounted on a tab, leads alternately arranged around the tab are electrically connected to electrodes of the semiconductor chip via bonding wires, and encapsulating resin encapsulates the semiconductor chip and bonding wires. The lower surfaces of the leads are exposed at the outer periphery of the back surface of the encapsulating resin to form external terminals. The lower surfaces of the leads are exposed at the back surface of the encapsulating resin located inwardly of the lower exposed surface of the leads to form external terminals. The cut surfaces of the leads are exposed at the cut surfaces of the encapsulating resin, while upper exposed surfaces of the leads are exposed from the encapsulating resin portion which is proximate to the cut surfaces thereof. Each of the upper exposed surfaces of the leads has a width smaller than the width of each of the lower exposed surfaces.
REFERENCES:
patent: 6713849 (2004-03-01), Hasebe et al.
patent: 2002/0109242 (2002-08-01), Kasuga et al.
patent: 2003/0006055 (2003-01-01), Chien-Hung et al.
patent: 2001-24133 (2001-01-01), None
Amano Kenji
Fujisawa Atsushi
Hasebe Hajime
Antonelli, Terry Stout & Kraus, LLP.
Nguyen Tuan H.
Renesas Northern Japan Semiconductor, Inc.
Renesas Technology Corp.
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