Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2008-04-29
2008-04-29
Gutierrez, Diego (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S799000, C361S753000, C361S816000, C361S818000, C174S350000
Reexamination Certificate
active
07365992
ABSTRACT:
An electronic circuit package includes a first electronic module, a second electronic module, and an electric shielding layer. The first electronic module and the second electronic module are bonded in such a way that integrated devices are opposite to each other. The electric shielding layer is inserted between the first electronic module and the second electronic module for ensuring electric insulation between the first electronic module and the second electronic module.
REFERENCES:
patent: 5159537 (1992-10-01), Okano
patent: 5777856 (1998-07-01), Phillips et al.
patent: 5864088 (1999-01-01), Sato et al.
patent: 6341063 (2002-01-01), Kinoshita et al.
patent: 6574103 (2003-06-01), Hinterlong
patent: 6590783 (2003-07-01), Spratte et al.
patent: 6621708 (2003-09-01), Sparkes et al.
patent: 6674652 (2004-01-01), Forte et al.
patent: 6972967 (2005-12-01), Norte et al.
patent: 7161092 (2007-01-01), Glovatsky
patent: 7177161 (2007-02-01), Shima
Cha & Reiter LLC
Gutierrez Diego
Levi Dameon E
Samsung Electronics Co,. Ltd.
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