Smart conditioner rinse station

Abrading – Abrading process – With tool treating or forming

Reexamination Certificate

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Details

C451S443000

Reexamination Certificate

active

07914363

ABSTRACT:
A method and apparatus for monitoring polishing pad conditioning mechanisms is provided. In one embodiment, a semiconductor substrate polishing system includes a rinse station, a polishing surface, a conditioning element, and a conditioning mechanism. The conditioning mechanism selectively positions the conditioning element over the polishing surface and over the rinse station. At least one sensor is provided and is configured to detect a first position and a second position of the conditioning element when disposed over the rinse station.

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