Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
Reexamination Certificate
2008-04-22
2008-04-22
Lee, Hsien-Ming (Department: 2823)
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
C438S458000, C257SE21568, C257SE21570
Reexamination Certificate
active
07361573
ABSTRACT:
The invention aims to provide a peeling method without damaging a peeled off layer and to allow separation of not only a peeled off layer having a small surface area but also the entire surface of a peeled off layer having a large surface area. Further, the invention aims to provide a lightweight semiconductor device by sticking a peeled off layer to a variety of substrates and its manufacturing method. Especially, the invention aims to provide a lightweight semiconductor device by sticking a variety of elements such as TFT to a flexible film and its manufacturing method. Even in the case a first material layer11is formed on a substrate and a second material layer12is formed adjacently to the foregoing first material layer11,and further, layered film formation, heating treatment at 500° C. or higher or laser beam radiating treatment is carried out, if the first material layer has a tensile stress before the peeling and the second material layer has a compressive stress, excellent separation can easily be carried out by physical means in the interlayer or interface of the second material layer12.
REFERENCES:
patent: 4722765 (1988-02-01), Ambros et al.
patent: 5206749 (1993-04-01), Zavracky et al.
patent: 5258325 (1993-11-01), Spitzer et al.
patent: 5317236 (1994-05-01), Zavracky et al.
patent: 5341015 (1994-08-01), Kohno
patent: 5376561 (1994-12-01), Vu et al.
patent: 5391257 (1995-02-01), Sullivan et al.
patent: 5397713 (1995-03-01), Hamamoto et al.
patent: 5654811 (1997-08-01), Spitzer et al.
patent: 5674304 (1997-10-01), Fukada et al.
patent: 5757456 (1998-05-01), Yamazaki et al.
patent: 5781164 (1998-07-01), Jacobsen et al.
patent: 5807440 (1998-09-01), Kubota et al.
patent: 5821138 (1998-10-01), Yamazaki et al.
patent: 5834327 (1998-11-01), Yamazaki et al.
patent: 5851862 (1998-12-01), Ohtani et al.
patent: 5879741 (1999-03-01), Itoh
patent: 6033974 (2000-03-01), Henley et al.
patent: 6043800 (2000-03-01), Spitzer et al.
patent: 6059913 (2000-05-01), Asmussen et al.
patent: 6100166 (2000-08-01), Sakaguchi et al.
patent: 6118502 (2000-09-01), Yamazaki et al.
patent: 6127199 (2000-10-01), Inoue et al.
patent: 6221738 (2001-04-01), Sakaguchi et al.
patent: 6258666 (2001-07-01), Mizutani et al.
patent: 6261634 (2001-07-01), Itoh
patent: 6268695 (2001-07-01), Affinito
patent: 6310362 (2001-10-01), Takemura
patent: 6320640 (2001-11-01), Nishi et al.
patent: 6339010 (2002-01-01), Sameshima
patent: 6340641 (2002-01-01), Muraguchi et al.
patent: 6362866 (2002-03-01), Yamazaki et al.
patent: 6372608 (2002-04-01), Shimoda et al.
patent: 6376333 (2002-04-01), Yamazaki et al.
patent: 6391220 (2002-05-01), Zhang et al.
patent: 6420283 (2002-07-01), Ogawa et al.
patent: 6423614 (2002-07-01), Doyle
patent: 6429095 (2002-08-01), Sakaguchi et al.
patent: 6448152 (2002-09-01), Henley et al.
patent: 6486041 (2002-11-01), Henley et al.
patent: 6492026 (2002-12-01), Graff et al.
patent: 6521511 (2003-02-01), Inoue et al.
patent: 6534382 (2003-03-01), Sakaguchi et al.
patent: 6544430 (2003-04-01), McCormack et al.
patent: 6572780 (2003-06-01), McCormack et al.
patent: 6627518 (2003-09-01), Inoue et al.
patent: 6632708 (2003-10-01), Sakama et al.
patent: 6645830 (2003-11-01), Shimoda et al.
patent: 6664169 (2003-12-01), Iwasaki et al.
patent: 6682963 (2004-01-01), Ishikawa
patent: 6682990 (2004-01-01), Iwane et al.
patent: RE38466 (2004-03-01), Inoue et al.
patent: 6700631 (2004-03-01), Inoue et al.
patent: 6737285 (2004-05-01), Iketani et al.
patent: 6753212 (2004-06-01), Yamazaki et al.
patent: 6774010 (2004-08-01), Chu et al.
patent: 6781152 (2004-08-01), Yamazaki
patent: 6784113 (2004-08-01), Hembree
patent: 6790747 (2004-09-01), Henley et al.
patent: 6802926 (2004-10-01), Mizutani et al.
patent: 6814832 (2004-11-01), Utsunomiya
patent: 6815240 (2004-11-01), Hayashi
patent: 6818530 (2004-11-01), Shimoda et al.
patent: 6875671 (2005-04-01), Faris
patent: 6878607 (2005-04-01), Inoue et al.
patent: 6885389 (2005-04-01), Inoue et al.
patent: 6943369 (2005-09-01), Hayashi
patent: 6946361 (2005-09-01), Takayama et al.
patent: 6974731 (2005-12-01), Yamazaki et al.
patent: 7045438 (2006-05-01), Yamazaki et al.
patent: 7052978 (2006-05-01), Shaheen et al.
patent: 7094665 (2006-08-01), Shimoda et al.
patent: 7119364 (2006-10-01), Yamazaki
patent: 7122445 (2006-10-01), Takayama et al.
patent: 2001/0004121 (2001-06-01), Sakama et al.
patent: 2001/0022362 (2001-09-01), Hayashi
patent: 2002/0106522 (2002-08-01), McCormack et al.
patent: 2003/0032210 (2003-02-01), Takayama et al.
patent: 2003/0040164 (2003-02-01), Inoue et al.
patent: 2003/0047280 (2003-03-01), Takayama et al.
patent: 2003/0047732 (2003-03-01), Yamazaki et al.
patent: 2003/0082889 (2003-05-01), Maruyama et al.
patent: 2003/0134488 (2003-07-01), Yamazaki et al.
patent: 2003/0162312 (2003-08-01), Takayama et al.
patent: 2003/0203547 (2003-10-01), Sakaguchi et al.
patent: 2003/0217805 (2003-11-01), Takayama et al.
patent: 2004/0129960 (2004-07-01), Maruyama et al.
patent: 2004/0132265 (2004-07-01), Maruyama et al.
patent: 2004/0232413 (2004-11-01), Yamazaki et al.
patent: 2006/0121691 (2006-06-01), Noguchi et al.
patent: 2007/0212853 (2007-09-01), Maruyama et al.
patent: 0 849 788 (1998-06-01), None
patent: 0 858 110 (1998-08-01), None
patent: 0 924 769 (1999-06-01), None
patent: 1 014 452 (2000-06-01), None
patent: 1 351 308 (2003-10-01), None
patent: 01-184957 (1989-07-01), None
patent: 05-243519 (1993-09-01), None
patent: 05-347186 (1993-12-01), None
patent: 07-142570 (1995-06-01), None
patent: 09-105896 (1997-04-01), None
patent: 10-125929 (1998-05-01), None
patent: 10-125930 (1998-05-01), None
patent: 10-125931 (1998-05-01), None
patent: 11-087799 (1999-03-01), None
patent: 11-135882 (1999-05-01), None
patent: 11-243209 (1999-09-01), None
patent: 2000-040812 (2000-02-01), None
patent: 2001-051296 (2001-02-01), None
patent: 2001-085154 (2001-03-01), None
patent: 2001-125138 (2001-05-01), None
patent: 2001-166301 (2001-06-01), None
patent: 2001-189460 (2001-07-01), None
patent: 2001-267578 (2001-09-01), None
patent: 3238223 (2001-10-01), None
patent: 3238223 (2001-12-01), None
patent: 2002-184959 (2002-06-01), None
patent: 2002-217391 (2002-08-01), None
patent: 2002-328624 (2002-11-01), None
patent: 2003-142666 (2003-05-01), None
patent: WO 99/44242 (1999-09-01), None
T. Takayama et al.,A CPU on a Plastic Film Substrate, 2004 Symposium on VLSI Technology, Digest of Technical Papers, Jun. 15, 2004, pp. 230-231.
Maruyama Junya
Takayama Toru
Yamazaki Shunpei
Lee Hsien-Ming
Robinson Eric J.
Robinson Intellectual Property Law Office P.C.
Semiconductor Energy Laboratory Co,. Ltd.
LandOfFree
Method of peeling off and method of manufacturing... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of peeling off and method of manufacturing..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of peeling off and method of manufacturing... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2774149