Apparatus and method for forming bump

Metal fusion bonding – With control means responsive to sensed condition – Work-responsive

Reexamination Certificate

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C228S234100, C438S613000

Reexamination Certificate

active

07350684

ABSTRACT:
A preheat device (160) is provided to execute, before forming bumps (16) to electrode parts (15), a pre-formation temperature control for bonding promotion to promote bonding between the electrode parts and the bumps during bump formation. Metal particles of the electrode parts can be changed to an appropriate state before the bump formation. Phenomenally, a bonding state between the electrode parts and the bumps can be improved as compared with the conventional art. In a further arrangement of the present invention, semiconductor components with bumps can be heated under a bonding strength improvement condition by a bonding stage (316) through controlling the heating by a controller (317).

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