Methods of making metal core foldover package structures

Details Methods of making metal core foldover package structures Methods of making metal core foldover package structures

2011-03-29

2011-03-29

Quach, Tuan N. (Department: 2893)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S109000, C438S121000, C257SE21499

Reexamination Certificate

active

07915077

ABSTRACT:
Chip-scale packages and assemblies thereof and methods of fabricating such packages including Chip-On-Board, Board-On-Chip, and vertically stacked Package-On-Package modules are disclosed. The chip-scale package includes a core member of a metal or alloy having a recess for at least partially receiving a die therein and includes at least one flange member partially folded over another portion of the core member. Conductive traces extend from one side of the package over the at least one flange member to an opposing side of the package. Systems including the chip-scale packages and assemblies are also disclosed.

REFERENCES:
patent: 5151769 (1992-09-01), Immorlica et al.
patent: 5347159 (1994-09-01), Khandros et al.
patent: 5386341 (1995-01-01), Olson et al.
patent: 5394303 (1995-02-01), Yamaji
patent: 5448511 (1995-09-01), Paurus et al.
patent: 5552910 (1996-09-01), Okano
patent: 5646446 (1997-07-01), Nicewarner, Jr. et al.
patent: 5764484 (1998-06-01), Hoffman et al.
patent: 5776797 (1998-07-01), Nicewarner, Jr. et al.
patent: 5904496 (1999-05-01), Richards et al.
patent: 5982030 (1999-11-01), MacIntrye
patent: 6028365 (2000-02-01), Akram et al.
patent: 6172418 (2001-01-01), Iwase
patent: 6208521 (2001-03-01), Nakatsuka
patent: 6225688 (2001-05-01), Kim et al.
patent: 6291892 (2001-09-01), Yamaguchi
patent: 6300679 (2001-10-01), Mukerji et al.
patent: 6365434 (2002-04-01), Rumsey et al.
patent: 6376769 (2002-04-01), Chung
patent: 6486544 (2002-11-01), Hashimoto
patent: 6563223 (2003-05-01), Freeman
patent: 6576992 (2003-06-01), Cady et al.
patent: 6600222 (2003-07-01), Levardo
patent: 6706553 (2004-03-01), Towle et al.
patent: 6833614 (2004-12-01), Higuchi
patent: 6914324 (2005-07-01), Rapport et al.
patent: 6919626 (2005-07-01), Burns
patent: 6940729 (2005-09-01), Cady et al.
patent: 6955945 (2005-10-01), Rapport et al.
patent: 6956284 (2005-10-01), Cady et al.
patent: 7026708 (2006-04-01), Cady et al.
patent: 7053478 (2006-05-01), Roper et al.
patent: 7094632 (2006-08-01), Cady et al.
patent: 7309914 (2007-12-01), Goodwin
patent: 7425758 (2008-09-01), Corisis et al.
patent: 7563645 (2009-07-01), Jaeck
patent: 2004/0000707 (2004-01-01), Roper et al.
patent: 2004/0115866 (2004-06-01), Bang et al.
patent: 2004/0217471 (2004-11-01), Haba
patent: 2005/0009234 (2005-01-01), Partridge et al.
patent: 2005/0073846 (2005-04-01), Takine
patent: 2005/0098873 (2005-05-01), Wehrly, Jr.
patent: 2005/0104205 (2005-05-01), Wang
patent: 2005/0280135 (2005-12-01), Rapport et al.
patent: 2006/0055038 (2006-03-01), Mu
patent: 2008/0316728 (2008-12-01), Corisis et al.
patent: 2010/0276799 (2010-11-01), Heng et al.
patent: 10227305 (2003-09-01), None
International Search Report dated Apr. 11, 2008, for International Application No. PCT/US2007/076286 (4 pages).
International Preliminary Report on Patentability dated Mar. 3, 2009 for International Application No. PCT/US2007/076286 (6 pages).
Written Opinion dated Apr. 11, 2008, for International Application No. PCT/US2007/076286 (5 pages).

Affiliated with

Also associated with

Rating

Methods of making metal core foldover package structures does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Methods of making metal core foldover package structures, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods of making metal core foldover package structures will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2766292