Scheduling method for robotic manufacturing processes

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36446801, 36446805, 36446808, G06F 1900, G06G 764, G06G 766

Patent

active

058019456

ABSTRACT:
A scheduling method for robotic manufacturing processes that can be used in the processing of semiconductor wafers employs planning of dispatch times for wafers based on predetermined durations for some operations and estimated durations for other operations. Dispatch is based on the actual execution time for operations, but the planned order of operations is not changed. The planning of dispatch times is modified based upon the measurement of actual execution times of operations that were formerly estimated. Specific wafers are identified and a chain of custody is established during planning and dispatch.

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