Methods for making a sloped insulator for solid state devices

Details Methods for making a sloped insulator for solid state devices Methods for making a sloped insulator for solid state devices

1977-06-14

1978-07-04

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29579, 156661, 357 24, H01L 21306

Patent

active

040986381

ABSTRACT:
A method for making a sloped insulator for use in a solid state device is also described in which the surface of the insulation layer which is oppositely disposed from the interface of the insulation layer with the semiconductor wafer is provided with areas having a controlled slope with respect to the plane of the insulation-semiconductor interface.

REFERENCES:
patent: 3200311 (1965-08-01), Thomas et al.
patent: 3483108 (1969-12-01), Schaefer
patent: 3713922 (1973-01-01), Lepselter et al.
patent: 3769109 (1973-10-01), MacRea et al.
patent: 3825454 (1974-07-01), Kikuchi et al.
patent: 3837907 (1974-09-01), Berglund et al.
patent: 3842490 (1974-10-01), Seales
patent: 3880684 (1975-04-01), Abe
patent: 3980508 (1976-09-01), Takamiya et al.

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