Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor
Reexamination Certificate
2008-04-01
2008-04-01
Williams, Alexander Oscar (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With bumps on ends of lead fingers to connect to semiconductor
C257SE23069, C257SE25029, C257SE23178, C257SE23021, C257SE21512, C257SE23135, C257S734000, C257S737000, C257S738000, C257S696000, C257S666000, C257S690000, C257S691000, C257S693000, C257S692000, C257S698000
Reexamination Certificate
active
07352054
ABSTRACT:
A semiconductor device includes a base plate, at least one first conductive layer carried by the base plate, and a semiconductor constructing body formed on or above the base plate, and having a semiconductor substrate and a plurality of external connecting electrodes formed on the semiconductor substrate. An insulating layer is formed on the base plate around the semiconductor constructing body. A plurality of second conductive layers are formed on the insulating layer and electrically connected to the external connecting electrodes of the semiconductor constructing body. A vertical conducting portion is formed on side surfaces of the insulating film and base plate, and electrically connects the first conductive layer and at least one of the second conductive layers.
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Casio Computer Co. Ltd.
Frishauf Holtz Goodman & Chick P.C.
Williams Alexander Oscar
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