Wafer processing method

Details Wafer processing method Wafer processing method

2008-07-15

2008-07-15

Whitehead, Jr., Carl (Department: 2813)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

By electromagnetic irradiation

C438S033000, C438S113000, C438S114000, C438S458000, C438S460000, C438S463000, C438S465000, C438S758000

Reexamination Certificate

active

07399682

ABSTRACT:
A wafer processing method for carrying out processing by applying a laser beam along streets formed on a wafer, comprising a step of applying a laser beam at an incident angle of a predetermined inclination angle to the normal line of a processing surface of the wafer while the wafer is processing-fed along a street from one end to the other end on the side of the laser beam application at an acute angle to the processing surface of the wafer.

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