Thermal coupling of matched SOI device bodies

Details Thermal coupling of matched SOI device bodies Thermal coupling of matched SOI device bodies

2008-07-08

2008-07-08

Warren, Matthew E (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Field effect device

Having insulated electrode

C257S369000, C257S401000, C257S506000

Reexamination Certificate

active

07397085

ABSTRACT:
Performance matching devices in SOI are improved by thermally isolating matched devices within a continuous body of active material. Matched devices are isolated by an insulating wall of silicon dioxide (which surrounds the devices) and the oxide layer beneath, and are arranged to minimize effects from external thermal sources.

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