Multi-sheet conductive substrates for microelectronic...

Details Multi-sheet conductive substrates for microelectronic... Multi-sheet conductive substrates for microelectronic...

2008-04-22

2008-04-22

Geyer, Scott B. (Department: 2812)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257SE23141, C361S748000

Reexamination Certificate

active

07361979

ABSTRACT:
A substrate is provided having a plurality of sheets. Each sheet has a first major surface containing a plurality of electrically conductive regions and a second major surface that opposes the first major surface. The sheets are arranged such that the first major surface of a sheet faces the second major surface of another. At least one electrically conductive region of each sheet is partially or fully exposed. At least one electrically conductive region of a sheet is partially or fully covered, e.g., by one or more electrically conductive regions of another sheet. A method for forming such a substrate is also provided.

REFERENCES:
patent: 6313522 (2001-11-01), Akram et al.
patent: 6372620 (2002-04-01), Oosawa et al.
patent: 6528874 (2003-03-01), Iijima et al.
patent: 6617236 (2003-09-01), Oosawa
patent: 6625032 (2003-09-01), Ito et al.
patent: 6646337 (2003-11-01), Iijima et al.
patent: 2002/0140076 (2002-10-01), Yamazaki et al.
Haba et al., U.S. Appl. No. 10/917,978, filed Aug. 13, 2004.
Humpston et al., U.S. Appl. No. 10/949,674, filed Sep. 24, 2004.

Affiliated with

Also associated with

Rating

Multi-sheet conductive substrates for microelectronic... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multi-sheet conductive substrates for microelectronic..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multi-sheet conductive substrates for microelectronic... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2742696