Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2011-06-07
2011-06-07
Dang, Phuc T (Department: 2892)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257SE23002, C257SE23080, C438S106000, C438S108000
Reexamination Certificate
active
07956457
ABSTRACT:
An apparatus and method, the apparatus includes a substrate configured to support a plurality of dielectric layers, a device coupling area positioned in the substrate, and a plurality of gas exit apertures formed through the substrate. The plurality of gas exit apertures is configured to provide venting of at least one of moisture and outgassed material and the device coupling area is configured to receive an electronic device coupleable to the plurality of dielectric layers.
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Burke Elizabeth A.
Durocher Kevin M.
Fillion Raymond Albert
Gorczyca Thomas Bert
Woychik Charles G.
Dang Phuc T
General Electric Company
Testa Jean K.
Ziolkowski Patent Solutions Group, SC
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