Method for fabrication of single crystal diodes for...

Semiconductor device manufacturing: process – Formation of semiconductive active region on any substrate – Amorphous semiconductor

Reexamination Certificate

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C438S365000, C438S366000, C438S367000, C438S368000, C438S377000, C438S482000, C438S486000, C438S495000, C438S517000, C257S044000, C257S046000, C257S104000, C257S544000, C257S653000, C257SE31077, C257SE31090, C257SE27069, C257SE29090, C257SE29196

Reexamination Certificate

active

07902051

ABSTRACT:
The present invention, in one embodiment, provides a method of producing a PN junction the method including providing a single crystal substrate; forming an insulating layer on the single crystal substrate; forming a via through the insulating layer to provide an exposed portion of the single crystal substrate; forming amorphous Si on at least the exposed portion of the single crystal substrate; converting at least a portion of the amorphous Si into single crystal Si; and forming dopant regions in the single crystal Si. In one embodiment the diode of the present invention is integrated with a memory device.

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