Electrical wiring structure, liquid ejection head, liquid...

Details Electrical wiring structure, liquid ejection head, liquid... Electrical wiring structure, liquid ejection head, liquid...

2011-01-04

2011-01-04

Nguyen, Thinh H (Department: 2861)

Incremental printing of symbolic information

Ink jet

Ejector mechanism

C347S058000

Reexamination Certificate

active

07862153

ABSTRACT:
The electrical wiring structure includes an electrical connection section where a first electrode and a second electrode are connected, wherein: the electrical connection section is formed by a first alloy containing at least gallium metal; and the first alloy has a melting point lower than 30° C.

REFERENCES:
patent: 5939789 (1999-08-01), Kawai et al.
patent: 6530650 (2003-03-01), Ozaki et al.
patent: 2010/0041252 (2010-02-01), Mizukami et al.
patent: 7-240582 (1995-09-01), None
patent: 2003-234576 (2003-08-01), None

Affiliated with

Also associated with

Rating

Electrical wiring structure, liquid ejection head, liquid... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electrical wiring structure, liquid ejection head, liquid..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electrical wiring structure, liquid ejection head, liquid... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2735251