Stacked structure of semiconductor package

Details Stacked structure of semiconductor package Stacked structure of semiconductor package

1999-06-04

2000-12-19

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

257730, 257666, H01L 2348, H01L 2352, H01L 2940

Patent

active

061630764

ABSTRACT:
A stacked structure of a semiconductor package mainly comprises a first chip, a second chip, a substrate and a lead frame. The first chip and the second chip are attached on the surface of the substrate by a plurality of solder bumps by means of flipchip bonding. Then, the first chip, the second chip and the substrate form a stacked structure. A plurality of plugs of the substrate is provided along an edge of the substrate so as to attach to a plurality of receptacles of the lead frame to form a semiconductor device. The plugs are attached to the receptacles of the lead frame by silver paste to form a semiconductor device in such a way that the first chip and the second chip electrically connect to the lead frame. In addition, the lead frame is bent to form a plurality of fingers, which is placed in a space that is formed by a sidewall of the chip and a surface of the substrate while it is assembled. An encapsulant covers the stacked structure, then the fingers are exposed on the surface of the encapsulant, so that the first chip and the second chip can be operated by means of the fingers.

REFERENCES:
patent: 4463217 (1984-07-01), Orcutt
patent: 4691225 (1987-09-01), Murakami et al.
patent: 5293067 (1994-03-01), Thompson et al.
patent: 5388029 (1995-02-01), Moriyama
patent: 5729437 (1998-03-01), Hashimoto
patent: 5861668 (1999-01-01), Cha

Affiliated with

Also associated with

Rating

Stacked structure of semiconductor package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Stacked structure of semiconductor package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Stacked structure of semiconductor package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-273234