Semiconductor device and method of designing the same

Semiconductor device manufacturing: process – With measuring or testing – Electrical characteristic sensed

Reexamination Certificate

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C257S048000, C257S306000

Reexamination Certificate

active

07977124

ABSTRACT:
A semiconductor device includes a first wiring layer, a second wiring layer and an insulating layer provided between the first wiring layer and the second wiring layer. A capacitor has a first electrode formed on the first wiring layer and a second electrode formed on the second wiring layer in such a manner that the second electrode overlaps with the first electrode. To the first electrode, two connection wirings are connected and, to the second electrode, two connection wirings are connected. The two connection wirings are connected to each other with low DC impedance substantially only through the first electrode. Similarly, the two connection wirings are connected to each other with low DC impedance substantially only through the second electrode.

REFERENCES:
patent: 5977565 (1999-11-01), Ishikawa et al.

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