Semiconductor device manufacturing: process – With measuring or testing – Electrical characteristic sensed
Reexamination Certificate
2011-07-12
2011-07-12
Lee, Calvin (Department: 2892)
Semiconductor device manufacturing: process
With measuring or testing
Electrical characteristic sensed
C257S048000, C257S306000
Reexamination Certificate
active
07977124
ABSTRACT:
A semiconductor device includes a first wiring layer, a second wiring layer and an insulating layer provided between the first wiring layer and the second wiring layer. A capacitor has a first electrode formed on the first wiring layer and a second electrode formed on the second wiring layer in such a manner that the second electrode overlaps with the first electrode. To the first electrode, two connection wirings are connected and, to the second electrode, two connection wirings are connected. The two connection wirings are connected to each other with low DC impedance substantially only through the first electrode. Similarly, the two connection wirings are connected to each other with low DC impedance substantially only through the second electrode.
REFERENCES:
patent: 5977565 (1999-11-01), Ishikawa et al.
Cantor & Colburn LLP
Lee Calvin
Rohm & Co., Ltd.
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