Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Reexamination Certificate
2011-06-07
2011-06-07
Trinh, Michael (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Field effect device
Having insulated electrode
C257S408000, C257S410000, C257SE21433
Reexamination Certificate
active
07956413
ABSTRACT:
In a method for manufacturing a semiconductor device having an N-channel field effect transistor, the N-channel field effect transistor is formed by a process including the steps of forming a high dielectric constant gate insulating film on a substrate, forming a gate electrode on the high dielectric constant gate insulating film, forming an extension region by introducing N-type impurities into the substrate by using at least the gate electrode as a mask, and forming a pocket region by introducing P-type impurities under the extension region in the substrate by using at least the gate electrode as a mask. An amount of arsenic (As) that is introduced as the N-type impurities is in a range that is equal to or lower than a prescribed value that is determined based on a thickness of the high dielectric constant gate insulating film.
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English translation of Japanese Notice of Reasons for Rejection issued in Japanese Patent Application No. JP 2004-362971 dated Dec. 15, 2009.
A. Kaneko, et al., “Flatband Voltage Shift Caused by Dopants Diffused from Poly-Si Gate Electrode in Poly-Si /HfSiO/SiO2/Si”, Extended Abstracts of the 2003 International Conference on Solid State Devices and Materials, Tokyo, 2003, pp. 56-57.
Harada Yoshinao
Hayashi Shigenori
Niwa Masaaki
McDermott Will & Emery LLP
Panasonic Corporation
Trinh Michael
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