Microelectronic connections with solid core joining units

Details Microelectronic connections with solid core joining units Microelectronic connections with solid core joining units

1995-03-28

1998-09-01

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

257738, 257772, 257777, 257779, H01L 2312, H01L 2350, H01L 2314

Patent

active

058014462

ABSTRACT:
A microelectronic component such as a semiconductor chip having electrical contacts is provided with terminals, the terminals being movable relative to the component. A joining unit having a solid core is disposed on each terminal and extends upwardly, away from the component. Each unit includes a bonding material such as a solder bonding the terminal and the solid core, the bonding material desirably defining a waist or narrow section spaced above the terminal, the waist having a curved surface forming a stress-relieving fillet. The joining units are bonded to contact pads of a substrate such as a circuit panel as by bonding the solder of the joining units to the terminals, or by means of a further solder on the contact pads having a lower melting point. The assembly provides substantial resistance to mechanical stress caused by thermal expansion. Preferably, the terminals are movable in vertical directions towards the component to compensate for nonplanarity during assembly.

REFERENCES:
patent: 3303393 (1967-02-01), Hymes et al.
patent: 3797103 (1974-03-01), Desmond et al.
patent: 3871015 (1975-03-01), Lin et al.
patent: 4606962 (1986-08-01), Reylek et al.
patent: 4788767 (1988-12-01), Desai et al.
patent: 4797103 (1989-01-01), Pittman
patent: 4818728 (1989-04-01), Rai et al.
patent: 4857482 (1989-08-01), Saito et al.
patent: 4937006 (1990-06-01), Bickford et al.
patent: 5065227 (1991-11-01), Frankeny et al.
patent: 5070297 (1991-12-01), Kwon et al.
patent: 5090609 (1992-02-01), Nakao et al.
patent: 5093986 (1992-03-01), Mandai et al.
patent: 5103290 (1992-04-01), Temple et al.
patent: 5115964 (1992-05-01), Ameen et al.
patent: 5133495 (1992-07-01), Angulas et al.
patent: 5135890 (1992-08-01), Temple et al.
patent: 5148265 (1992-09-01), Khandros et al.
patent: 5148266 (1992-09-01), Khandros et al.
patent: 5154341 (1992-10-01), Melton et al.
patent: 5233504 (1993-08-01), Melton et al.
patent: 5300340 (1994-04-01), Calhoun et al.
patent: 5316787 (1994-05-01), Frankeny et al.
patent: 5347159 (1994-09-01), Khandros et al.
patent: 5376584 (1994-12-01), Agarwala
patent: 5394490 (1995-02-01), Kato et al.
patent: 5448114 (1995-09-01), Kondoh et al.
McCormick, John E., "Metals Joining of Electronic Circuitry", pp. 13-1; 13-30--13-53, .COPYRGT.1970 by McGraw-Hill, Inc.
Bottcher, M., Rzepka, S. and Sadowski, G., "High density flexible circuits with solder ball arrays", Flexcon.TM. '94, 1994, .COPYRGT.1994 Semiconductor Technology Center, Inc., pp. 7-16.
Flip Chip Technology, A Technology Impact Report Jun. 1992, International Interconnection Intelligence Flip Chip Technology.
Neugebauer, CA et al., MCT Packaging, pp. 908-911.
Multichip Module Technologies and Alternatives: The Basics, "9.6 Flip Chip Solder Bump (FCSB) Technology: An Example", by Karl J. Puttlitz, Jr., pp. 450-476, .COPYRGT.1993 by Van Nostrand Reinhold.

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