Die bonder incorporating dual-head dispenser

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S758000

Reexamination Certificate

active

07977231

ABSTRACT:
Adhesive is dispensed for conducting die bonding onto a substrate including rows of bond pads aligned along a first axis and columns of bond pads aligned along a second axis transverse to the first axis where target dispensing positions are located. A first dispensing head incorporating a first nozzle and a second dispensing head incorporating a second nozzle are provided and the substrate is fed along the first axis to a position where the first and second dispensing heads are located. Pattern recognition of a columnar section of the substrate comprising one or more consecutive columns of bond pads with an optical system may be conducted by moving the optical system along the second axis relative to the substrate. Thereafter, the first nozzle and the second nozzle are driven concurrently to dispense adhesive from the first and second nozzles onto the target dispensing positions in the same columnar section of the substrate.

REFERENCES:
patent: 6204093 (2001-03-01), Ahmad
patent: 6331452 (2001-12-01), Gall
patent: 6861278 (2005-03-01), Quinones et al.
patent: 7358117 (2008-04-01), Tan et al.
patent: 7575953 (2009-08-01), Tan et al.
patent: 7799610 (2010-09-01), Tan et al.
patent: 7851930 (2010-12-01), Gupta

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Die bonder incorporating dual-head dispenser does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Die bonder incorporating dual-head dispenser, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Die bonder incorporating dual-head dispenser will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2722550

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.