Optical film thickness controlling method, optical film...

Details Optical film thickness controlling method, optical film... Optical film thickness controlling method, optical film...

2011-04-19

2011-04-19

McDonald, Rodney G (Department: 1724)

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

C204S298110, C118S720000, C118S721000, C118S730000, C118S665000, C118S688000, C118S691000

Reexamination Certificate

active

07927472

ABSTRACT:
To provide a method of controlling film thickness of dielectric multilayer film, such as optical thin film, with high precision, an optical film thickness controlling apparatus and a dielectric multilayer film manufacturing apparatus that can control the film thickness based on the same method, and dielectric multilayer film manufactured using the controlling apparatus or manufacturing apparatus. An optical film thickness controlling apparatus includes a film formation device15having a rotatable substrate23and a sputtering target28, a photodiode16that detects each of a plurality of monochromatic light beams applied to the rotatable substrate along a radius thereof at predetermined intervals, and an A/D converter17, in which a movable shutter29that moves along the direction of the radius of the rotatable substrate23to shut off film formation on the substrate23is provided between the substrate23and the target28. From each of the monochromatic light beams detected by the photodiode16and the A/D converter17, a quadratic regression function of reciprocal transmittance is calculated by a least squares method, and a CPU18and a motor driver19, which indicate motion of the movable shutter based on each predicted value of the film growing time when the latest surface layer film reaches to predetermined optical film thickness, move the movable shutter29to shut off the film formation at the film formation region where the predetermined optical film thickness is reached to.

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