Integrated circuit chip with FETs having mixed body...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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Details

C257S369000, C257S506000, C257SE27112

Reexamination Certificate

active

07968944

ABSTRACT:
An Integrated Circuit (IC) chip that may be a bulk CMOS IC chip with silicon on insulator (SOI) Field Effect Transistors (FETs) and method of making the chip. The IC chip includes areas with pockets of buried insulator strata and FETs formed on the strata are SOI FETs. The SOI FETs may include Partially Depleted SOI (PD-SOI) FETs and Fully Depleted SOI (FD-SOI) FETs and the chip may include bulk FETs as well. The FETs are formed by contouring the surface of a wafer, conformally implanting oxygen to a uniform depth, and planarizing to remove the Buried OXide (BOX) in bulk FET regions.

REFERENCES:
patent: 4523213 (1985-06-01), Konaka et al.
patent: 4879585 (1989-11-01), Usami
patent: 5399507 (1995-03-01), Sun
patent: 5463238 (1995-10-01), Takahashi et al.
patent: 5740099 (1998-04-01), Tanigawa
patent: 5894152 (1999-04-01), Jaso et al.
patent: 5956597 (1999-09-01), Furukawa et al.
patent: 6020222 (2000-02-01), Wollesen
patent: 6100565 (2000-08-01), Ueda
patent: 6127701 (2000-10-01), Disney
patent: 6140163 (2000-10-01), Gardner et al.
patent: 6214653 (2001-04-01), Chen et al.
patent: 6214694 (2001-04-01), Leobandung et al.
patent: 6288427 (2001-09-01), Huang
patent: 6324101 (2001-11-01), Miyawaki
patent: 6380037 (2002-04-01), Osanai
patent: 6403435 (2002-06-01), Kang et al.
patent: 6414355 (2002-07-01), An
patent: 6429488 (2002-08-01), Leobandung et al.
patent: 6465852 (2002-10-01), Ju
patent: 6486043 (2002-11-01), Hannon et al.
patent: 6531754 (2003-03-01), Nagano et al.
patent: 6548369 (2003-04-01), van Bentum
patent: 6569729 (2003-05-01), Wu et al.
patent: 6593627 (2003-07-01), Egashira
patent: 6630714 (2003-10-01), Sato et al.
patent: 6667518 (2003-12-01), Christensen et al.
patent: 6700144 (2004-03-01), Shimazaki et al.
patent: 6703673 (2004-03-01), Houston
patent: 6717217 (2004-04-01), Fogel et al.
patent: 6750486 (2004-06-01), Sugawara et al.
patent: 6774017 (2004-08-01), Brown et al.
patent: 6806554 (2004-10-01), Hsu
patent: 6825534 (2004-11-01), Chen et al.
patent: 6835981 (2004-12-01), Yamada et al.
patent: 6835983 (2004-12-01), Ning et al.
patent: 6852578 (2005-02-01), Chang
patent: 6876037 (2005-04-01), Wei et al.
patent: 6887772 (2005-05-01), Lee et al.
patent: 6906384 (2005-06-01), Yamada et al.
patent: 6909159 (2005-06-01), Friend et al.
patent: 6949420 (2005-09-01), Yamashita
patent: 6956265 (2005-10-01), Nagano et al.
patent: 7009273 (2006-03-01), Inoh et al.
patent: 7018904 (2006-03-01), Yamada et al.
patent: 7019365 (2006-03-01), Sato et al.
patent: 7049661 (2006-05-01), Yamada et al.
patent: 7061054 (2006-06-01), Tomiye et al.
patent: 7067371 (2006-06-01), Ning et al.
patent: 7087967 (2006-08-01), Mori et al.
patent: 7095081 (2006-08-01), Yamada et al.
patent: 7098146 (2006-08-01), Oyamatsu
patent: 7118986 (2006-10-01), Steigerwalt et al.
patent: 7141457 (2006-11-01), Ieong et al.
patent: 7141459 (2006-11-01), Yang et al.
patent: 7145215 (2006-12-01), Inoh et al.
patent: 7148543 (2006-12-01), Yamada et al.
patent: 7229892 (2007-06-01), Usuda et al.
patent: 7268023 (2007-09-01), Ramaswamy et al.
patent: 7274073 (2007-09-01), Anderson et al.
patent: 7323748 (2008-01-01), Yamada et al.
patent: 7410840 (2008-08-01), Tigelaar
patent: 7521760 (2009-04-01), Joshi et al.
patent: 7629233 (2009-12-01), Bernstein et al.
patent: 7682941 (2010-03-01), Anderson et al.
patent: 2003/0071308 (2003-04-01), Yoshida
patent: 2003/0104681 (2003-06-01), Davari et al.
patent: 2003/0151112 (2003-08-01), Yamada et al.
patent: 2004/0169226 (2004-09-01), Oyamatsu
patent: 2005/0121722 (2005-06-01), Oyamatsu
patent: 2006/0076628 (2006-04-01), Anderson et al.
patent: 2006/0163687 (2006-07-01), Williams
patent: 2006/0208314 (2006-09-01), Kaneko
patent: 2007/0190739 (2007-08-01), Zundel et al.
patent: 2007/0212857 (2007-09-01), Anderson et al.

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