Manufacturing method of contact structure

Details Manufacturing method of contact structure Manufacturing method of contact structure

2011-01-18

2011-01-18

Smith, Bradley K (Department: 2894)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C257SE21589, C438S612000

Reexamination Certificate

active

07871918

ABSTRACT:
A manufacturing method of a contact structure includes first providing a substrate on which a contact pad has already been formed. Afterwards, a polymer bump is formed on the contact pad. Next, a conductive layer is formed on the polymer bump. The conductive layer covers the polymer bump and extends to the outside of the polymer bump. The portion of the conductive layer extending to the outside of the polymer bump serves as a test pad.

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“1st Office Action of China counterpart application”, issued on Aug. 28, 2009, p. 1-p. 4.
“Notice of Allowance of Taiwan Counterpart Application” issued on Jun. 24, 2010, p. 1-p. 4, in which the listed references were cited.

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