Stack package and method for manufacturing the same

Details Stack package and method for manufacturing the same Stack package and method for manufacturing the same

2011-01-18

2011-01-18

Stark, Jarrett J (Department: 2823)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C257S620000, C257S686000, C257SE23085

Reexamination Certificate

active

07871925

ABSTRACT:
A stack package comprises a substrate having a circuit pattern; at least two semiconductor chips stacked on the substrate, having a plurality of through-via interconnection plugs and a plurality of guard rings which surround the respective through-via interconnection plugs, and connected with each other by the medium of the through-via interconnection plugs; a molding material for molding an upper surface of the substrate including the stacked semiconductor chips; and solder balls mounted to a lower surface of the substrate.

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