Methodology of improving the manufacturability of laser anneal

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

Reexamination Certificate

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C219S121660

Reexamination Certificate

active

07932139

ABSTRACT:
A method of laser annealing a workpiece for reduction of warpage, slip defects and breakage, the method comprising (a) moving a workpiece through a laser beam in a x-axis first direction, (b) moving the workpiece in a y-axis second direction, (c) moving the workpiece through a laser beam in a minus x-axis first direction and repeating (a)-(c) until the workpiece is fully annealed in two successive laser annealing iterations.

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