Ceramic package in which far end noise is reduced using...

Details Ceramic package in which far end noise is reduced using... Ceramic package in which far end noise is reduced using...

2011-03-08

2011-03-08

Doan, Nghia M (Department: 2825)

Computer-aided design and analysis of circuits and semiconductor

Nanotechnology related integrated circuit design

C716S030000, C716S030000, C716S030000, C716S030000, C716S030000, C716S030000, C716S030000, C716S030000, C703S013000, C703S014000

Reexamination Certificate

active

07904849

ABSTRACT:
A mechanism for reducing the vertical cross-talk interference experienced in signal lines due to the inductive affects from signal lines in other signal planes of a multi-layer ceramic package is provided. With the apparatus and method, one or more vias in the multi-layer ceramic package may be removed from the structure to provide area through which an offset of the signal lines may pass. Because these offsets of the signal lines exist in parallel planes above or below each other, with no ground lines existing directly between these signal line offsets, a capacitive cross-talk is introduced into the signal lines. This capacitive cross-talk is opposite in polarity to the inductive cross-talk already experienced by the signal lines. As a result, the capacitive cross-talk tends to negate or reduce the inductive cross-talk thereby reducing the far end noise in the signal line.

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