Semiconductor package structure having enhanced thermal...

Details Semiconductor package structure having enhanced thermal... Semiconductor package structure having enhanced thermal...

2011-05-17

2011-05-17

Such, Matthew W (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257SE23001

Reexamination Certificate

active

07944044

ABSTRACT:
In one embodiment, a packaged semiconductor device having enhanced thermal dissipation characteristics includes a lead frame structure and a semiconductor chip having a major current carrying or heat generating electrode. The semiconductor chip is oriented so that the major current carrying electrode faces the top of the package or away from the next level of assembly. The packaged semiconductor device further includes a non-planar, stepped or undulating attachment structure coupling the current carrying electrode to the lead frame. A high thermal conductivity mold compound and thin package profile further enhance thermal dissipation.

REFERENCES:
patent: 5221642 (1993-06-01), Burns
patent: 6255722 (2001-07-01), Ewer et al.
patent: 6975512 (2005-12-01), Ooi
patent: 7271477 (2007-09-01), Saito et al.
patent: 2004/0217488 (2004-11-01), Luechinger

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