Method of joining chips utilizing copper pillar

Details Method of joining chips utilizing copper pillar Method of joining chips utilizing copper pillar

2011-06-28

2011-06-28

Chambliss, Alonzo (Department: 2892)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S613000, C438S614000, C257S737000, C257S772000, C257S779000, C257S781000, C361S779000

Reexamination Certificate

active

07968372

ABSTRACT:
A copper pillar may be provided on a chip and a first tin-containing layer may be provided over the copper pillar. A second tin-containing layer may be provided on a substrate. The first tin-containing layer may be joined with the second tin-containing layer during a packaging process.

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