Structure for interconnect structure containing various...

Details Structure for interconnect structure containing various... Structure for interconnect structure containing various...

2011-06-07

2011-06-07

Soward, Ida M (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257S209000, C257S211000, C257S759000, C257S760000, C257SE21575, C257SE21577, C257SE21579, C257SE21580, C257SE21581, C257SE21583, C257SE21584, C257SE21585, C257SE21592, C257SE21627, C257SE21641

Reexamination Certificate

active

07956466

ABSTRACT:
A design structure is provided for interconnect structures containing various capping materials for electrical fuses and other related applications. The structure includes a first interconnect structure having a first interfacial structure and a second interconnect structure adjacent to the first structure. The second interconnect structure has second interfacial structure different from the first interfacial structure.

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