Substrate processing method and storage medium

Details Substrate processing method and storage medium Substrate processing method and storage medium

2011-07-26

2011-07-26

Lee, Cheung (Department: 2812)

Semiconductor device manufacturing: process

Coating of substrate containing semiconductor region or of...

Insulative material deposited upon semiconductive substrate

C438S700000, C438S709000, C438S725000, C257SE21218, C257SE21254, C257SE21492

Reexamination Certificate

active

07985699

ABSTRACT:
A substrate processing method capable of preventing a substrate rear surface from being scratched when attracted onto an electrostatic chuck. In a coater/developer (11), a photocurable resin is coated onto a rear surface of a wafer (W), the resin is cured to form a resin protective film, and a resist is coated onto a front surface of the wafer. An exposing apparatus (12) subjects the resist to light exposure processing, irradiating ultraviolet light onto a resist portion of a pattern reversed with respect to a mask pattern. The coater/developer uses a washing liquid to remove the resist, thereby forming a resist film. In an etching apparatus (13), the front surface of the wafer is electrostatically attracted onto an electrostatic chuck (49) is subjected to RIE processing. In a washing apparatus (14), the resin protective film is dissolved and removed.

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Office Action issued Jan. 5, 2011, in Japanese Patent Application No. 2006-079640 (with English translation). 6 pages.

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