Semiconductor chip, semiconductor mounting module, mobile...

Details Semiconductor chip, semiconductor mounting module, mobile... Semiconductor chip, semiconductor mounting module, mobile...

2011-05-17

2011-05-17

Lebentritt, Michael S (Department: 2829)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S636000, C438S642000, C438S686000, C438S723000, C438S732000, C257SE21581, C257SE21586, C257SE21596, C257SE23114, C257SE23159

Reexamination Certificate

active

07943518

ABSTRACT:
A semiconductor chip comprising a capacitor capable of effectively controlling the voltage drop of an LSI is provided. A semiconductor substrate is provided with an element electrode having at least its surface constituted of an aluminum electrode. The surface of the aluminum electrode is roughened. An oxide film is provided on the aluminum electrode. A conductive film is provided on the oxide film. The aluminum electrode, oxide film and conductive film form a capacitor.

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