Positive photoresist composition

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

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4302701, 4302811, 430326, G03C 1725

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active

058009663

ABSTRACT:
This invention provides a positive photoresist composition comprising an alkali-soluble resin, a dissolution inhibitor and a photo-induced acid precursor, wherein said alkali-soluble resin is obtainable through a condensation reaction of a compound represented by the general formula (I): ##STR1## wherein R.sub.1 to R.sub.9 each represent hydrogen atom, halogen atom, alkyl group, alkenyl group, --OH group or the like, provided that at least one of R.sub.1 to R.sub.9 is --OH group and at least two hydrogen atoms are attached to the o- or p-position of the --OH group, and an aldehyde. This positive photoresist composition is excellent in performances such as resolution, profile, sensitivity, etc.

REFERENCES:
patent: 4371605 (1983-02-01), Renner
Solid State Technology, Aug. 1991, Chemically Amplified Resists Lamola, et al, No. 8 Westford, MA US Aug. 1991.
8226, Ocrpe:Ectrpmoc Emgomeeromg 14(1991) Sep., No. 3/4, Amsterdam, NL Highly sensitive positive deep-UV resist . . . , Leo Schlegel et al.
The Japan Society of Applied Physics and Relaed Societies, The 38th Spring Meeting, 1991, (29a-ZC-7).
The Japan Society of Applied Physics and Related Societies, The 38th Spring Meeting, 1991, (30a-ZA-3).

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