Method for manufacturing semiconductor device

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

Reexamination Certificate

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Details

C438S197000, C438S222000, C438S308000, C438S458000, C257S347000, C257S351000, C257SE21567, C257SE21568

Reexamination Certificate

active

07951656

ABSTRACT:
A stack including at least an insulating layer, a first electrode, and a first impurity semiconductor layer is provided over a supporting substrate; a first semiconductor layer to which an impurity element imparting one conductivity type is added is formed over the first impurity semiconductor layer; a second semiconductor layer to which an impurity element imparting the one conductivity type is added is formed over the first semiconductor layer under a condition different from that of the first semiconductor layer; crystallinity of the first semiconductor layer and crystallinity of the second semiconductor layer are improved by a solid-phase growth method to form a second impurity semiconductor layer; an impurity element imparting the one conductivity type and an impurity element imparting a conductivity type different from the one conductivity type are added to the second impurity semiconductor layer; and a gate electrode layer is formed via a gate insulating layer.

REFERENCES:
patent: 4496788 (1985-01-01), Hamakawa et al.
patent: 5371037 (1994-12-01), Yonehara
patent: 5374564 (1994-12-01), Bruel
patent: 5665607 (1997-09-01), Kawama et al.
patent: 5736431 (1998-04-01), Shinohara et al.
patent: 5840616 (1998-11-01), Sakaguchi et al.
patent: 5854123 (1998-12-01), Sato et al.
patent: 6284629 (2001-09-01), Yokokawa et al.
patent: 6372609 (2002-04-01), Aga et al.
patent: 6380046 (2002-04-01), Yamazaki
patent: 6534380 (2003-03-01), Yamauchi et al.
patent: 6566277 (2003-05-01), Nakagawa et al.
patent: 6692981 (2004-02-01), Takato et al.
patent: 6818529 (2004-11-01), Bachrach et al.
patent: 7678668 (2010-03-01), Shimomura et al.
patent: 2001/0046746 (2001-11-01), Yokokawa et al.
patent: 2008/0099065 (2008-05-01), Ito et al.
patent: 0 971 395 (2000-01-01), None
patent: 59-124772 (1984-07-01), None
patent: 59-175170 (1984-10-01), None
patent: 06-044638 (1994-06-01), None
patent: 10-093122 (1998-04-01), None
patent: 10-335683 (1998-12-01), None
patent: 11-040786 (1999-02-01), None
patent: 11-097379 (1999-04-01), None
patent: 11-121310 (1999-04-01), None
patent: 11-163363 (1999-06-01), None
patent: 2000-030995 (2000-01-01), None
patent: 2000-150940 (2000-05-01), None
patent: 2002-348198 (2002-12-01), None
patent: 2005-268682 (2005-09-01), None

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