Method of manufacturing a stacked semiconductor apparatus

Details Method of manufacturing a stacked semiconductor apparatus Method of manufacturing a stacked semiconductor apparatus

2011-01-25

2011-01-25

Pizarro, Marcos D (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C257S777000, C257SE21499, C257SE21530, C438S015000

Reexamination Certificate

active

07875499

ABSTRACT:
There are provided a plurality of semiconductor apparatuses judged as good items in electrical and functional inspections while having internal connection terminals disposed on electrode pads of semiconductor chips, resin layers which are disposed on surfaces of the semiconductor chips in which the electrode pads are formed and expose the internal connection terminals, and wiring patterns which are disposed on the resin layers and are connected to the internal connection terminals, a wiring substrate on which the plurality of semiconductor apparatuses are stepwise stacked, the wiring substrate electrically connected to the plurality of semiconductor apparatuses, and a sealing resin with which the plurality of semiconductor apparatuses are sealed.

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