Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2011-06-21
2011-06-21
Smith, Zandra (Department: 2822)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S906000, C510S175000
Reexamination Certificate
active
07964495
ABSTRACT:
A method of manufacturing a CMOS image sensor manufacturing includes forming a plurality of metal pads over a semiconductor substrate; electrically connecting the metal pads to lower conductive film patterns of multi-layer metal wires using metal contacts; depositing an insulation film over the metal pads; patterning the insulation film to expose at least a portion of the upper surface of the metal pads; and removing impurities from an uppermost surface of the metal pads.
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patent: 6660564 (2003-12-01), Brady
patent: 1020000002332 (2000-01-01), None
patent: 1020040079614 (2004-09-01), None
Dongbu Hi-Tek Co., Ltd.
Perkins Pamela E
Sherr & Vaughn, PLLC
Smith Zandra
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