Substrate with multiple encapsulated pressures

Details Substrate with multiple encapsulated pressures Substrate with multiple encapsulated pressures

2011-01-25

2011-01-25

Lindsey, Jr., Walter L (Department: 2812)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

C438S055000, C257SE21499, C257SE29324

Reexamination Certificate

active

07875482

ABSTRACT:
A method of forming a device with multiple encapsulated pressures is disclosed herein. In accordance with one embodiment of the present invention, there is provided a method of forming a device with multiple encapsulated pressures, including providing a substrate, forming a functional layer on top of a surface of the substrate, the functional layer including a first device portion at a first location, and a second device portion at a second location adjacent to the first location, encapsulating the functional layer, forming at least one diffusion resistant layer above the encapsulated functional layer at a location above the first location and not above the second location, modifying an environment adjacent the at least one diffusion resistant layer, and diffusing a gas into the second location as a result of the modified environment.

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