Techniques for fabricating a non-planar transistor

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

Reexamination Certificate

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C438S156000, C438S212000, C257S302000, C257S329000, C257SE21422

Reexamination Certificate

active

07993988

ABSTRACT:
Methods for fabricating a non-planar transistor. Fin field effect transistors (finFETs) are often built around a fin (e.g., a tall, thin semiconductive member). During manufacturing, a fin may encounter various mechanical stresses, e.g., inertial forces during movement of the substrate and fluid forces during cleaning steps. If the forces on the fin are too large, the fin may fracture and possibly render a transistor inoperative. Supporting one side of a fin before forming the second side of a fin creates stability in the fin structure, thereby counteracting many of the mechanical stresses incurred during manufacturing.

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T. Park, et al.: “Fabrication of Body-Tied FinFETs (Oega MOSFETs) Using Bulk Si Wafers”; 2003 Symposium on VLSI Technology Digest of Technical Papers; Jun. 2003, 2 pages.
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