Metallised film for sheet contacting

Details Metallised film for sheet contacting Metallised film for sheet contacting

2011-03-22

2011-03-22

Pham, Thanh V (Department: 2894)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C361S795000

Reexamination Certificate

active

07910470

ABSTRACT:
An embodiment of the present invention discloses a method for contacting at least one electrical contact surface on a surface of a substrate and/or at least one component arranged on the substrate, especially a semiconductor chip. The method includes the following steps: at least one insulating film consisting of an electrically insulating plastic material is laminated, under a vacuum, onto the surfaces of the substrate and the component including the contact surface; and the contact surface to be contacted on the surfaces is bared by opening a window in the insulating film. An embodiment of the present invention further comprises sheet contacting the bared contact surface with at least one metallisation on an insulating film.

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