Method of reducing erosion of a metal cap layer during via...

Details Method of reducing erosion of a metal cap layer during via... Method of reducing erosion of a metal cap layer during via...

2011-07-26

2011-07-26

Potter, Roy K (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257S758000, C257S762000, C257SE23142

Reexamination Certificate

active

07986040

ABSTRACT:
During the patterning of via openings in sophisticated metallization systems of semi-conductor devices, the opening may extend through a conductive cap layer and an appropriate ion bombardment may be established to redistribute material of the underlying metal region to exposed sidewall portions of the conductive cap layer, thereby establishing a protective material. Consequently, in a subsequent wet chemical etch process, the probability for undue material removal of the conductive cap layer may be greatly reduced.

REFERENCES:
patent: 6380075 (2002-04-01), Cabral et al.
patent: 6528409 (2003-03-01), Lopatin et al.
patent: 6680247 (2004-01-01), Ueno
patent: 6756672 (2004-06-01), You et al.
patent: 6949457 (2005-09-01), Fiordalice et al.
patent: 7361589 (2008-04-01), Cunningham
patent: 2003/0040192 (2003-02-01), Kanegae
patent: 2003/0109129 (2003-06-01), Saito et al.
patent: 2004/0238961 (2004-12-01), Cunningham
patent: 2005/0127511 (2005-06-01), Yang et al.
patent: 2006/0118962 (2006-06-01), Huang et al.
patent: 2006/0163739 (2006-07-01), Komai et al.
patent: 2006/0264030 (2006-11-01), Fujiki
patent: 2007/0032062 (2007-02-01), Lee et al.
patent: 2007/0077761 (2007-04-01), Lehr et al.
patent: 2007/0224855 (2007-09-01), Lee et al.
Translation of Official Communication from German Patent Office for German Patent Application No. 10 2008 021 568.6 dated Oct. 24, 2008.

Affiliated with

Also associated with

Rating

Method of reducing erosion of a metal cap layer during via... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of reducing erosion of a metal cap layer during via..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of reducing erosion of a metal cap layer during via... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2665228