Semiconductor package and method of manufacturing the same

Details Semiconductor package and method of manufacturing the same Semiconductor package and method of manufacturing the same

2011-01-11

2011-01-11

Chu, Chris (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257SE23032, C257S666000, C257S780000, C438S121000

Reexamination Certificate

active

07868460

ABSTRACT:
Provided are a semiconductor package in which bonding pads of a semiconductor chip are electrically connected to interconnection portions by wire-bonding, and a method of manufacturing the semiconductor package. The semiconductor package includes: a substrate; an interconnection portion that is disposed on the substrate and comprises conductive patterns having a first thickness and conductive patterns having a second thickness that is smaller than the first thickness; at least one semiconductor chip that is mounted on the substrate and comprises a plurality of bonding pads; and a plurality of wires electrically connecting the conductive patterns and the bonding pads.

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