Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Reexamination Certificate
2011-03-08
2011-03-08
Kelly, Cynthia H (Department: 1722)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
C430S281100, C430S286100, C430S306000
Reexamination Certificate
active
07901863
ABSTRACT:
A photosensitive resin composition for a laser engravable printing substrate, comprising resin (a) having a polymerizable unsaturated group whose number average molecular weight is in the range of 1000 to 20×104, organic compound (b) having a polymerizable unsaturated group whose number average molecular weight is <1000 and organosilicon compound (c) having at least one Si—O bond in each molecule and having no polymerizable unsaturated group in molecules, wherein the content of organosilicon compound (c) is in the range of 0.1 to 10 wt. % based on the whole of photosensitive resin composition.
REFERENCES:
patent: 4218498 (1980-08-01), Cohen
patent: 4426431 (1984-01-01), Harasta et al.
patent: 5061598 (1991-10-01), Abe et al.
patent: 5310869 (1994-05-01), Lewis et al.
patent: 5378584 (1995-01-01), Frass et al.
patent: 5798202 (1998-08-01), Cushner et al.
patent: 5804353 (1998-09-01), Cushner et al.
patent: 6797455 (2004-09-01), Hiller et al.
patent: 2003/0224281 (2003-12-01), Ishizuka et al.
patent: 2004/0157162 (2004-08-01), Yokota et al.
patent: 56-64823 (1981-06-01), None
patent: 60-191238 (1985-09-01), None
patent: 3-118193 (1991-05-01), None
patent: 06-186740 (1994-07-01), None
patent: 7-276837 (1995-10-01), None
patent: 9-1916 (1997-01-01), None
patent: 9-146264 (1997-06-01), None
patent: 2846954 (1998-10-01), None
patent: 2846955 (1998-10-01), None
patent: 2001-121833 (2001-05-01), None
patent: 2002-292985 (2002-10-01), None
patent: 2003-528342 (2003-09-01), None
patent: 440952 (1974-09-01), None
patent: 798681 (1981-01-01), None
patent: WO 02/02346 (2002-01-01), None
patent: WO 03/022594 (2003-03-01), None
patent: WO 03/022594 (2003-03-01), None
patent: WO 2005/005147 (2005-01-01), None
“Tegopren 7008”, Evonik Industries, Juanuary 2008.
The Chemical Daily Co., Ltd., 10889 Chemical Products, ISBN 4-87326-040-X, pp. 691-692, (1989).
Tomeba Kei
Yamada Hiroshi
Asahi Kasei Chemicals Corporation
Eoff Anca
Finnegan Henderson Farabow Garrett & Dunner L.L.P.
Kelly Cynthia H
LandOfFree
Photosensitive resin composition for laser engravable... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Photosensitive resin composition for laser engravable..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Photosensitive resin composition for laser engravable... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2664212