Semiconductor device

Details Semiconductor device Semiconductor device

2011-03-15

2011-03-15

Chu, Chris (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With specified encapsulant

C257SE21502, C257S723000, C257S778000, C257S787000, C438S124000, C438S126000, C438S127000

Reexamination Certificate

active

07906860

ABSTRACT:
A semiconductor device is disclosed. One embodiment provides an arrangement of a plurality of semiconductor chips arranged side by side in a spaced apart relationship. A first material fills at least partly the spacings between adjacent semiconductor chips. A second material is arranged over the semiconductor chips and the first material. A coefficient of thermal expansion of the first material is selected to adapt the lateral thermal expansion of the arrangement in a plane intersecting the first material and the semiconductor chips to the lateral thermal expansion of the arrangement in a plane intersecting the second material.

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