Composition for producing printed circuit board and printed...

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Reexamination Certificate

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C174S250000, C428S195100, C428S458000, C428S901000, C252S299010, C252S299500, C427S099400

Reexamination Certificate

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07943856

ABSTRACT:
A composition for producing a printed circuit board is provided. The composition includes a polyamic acid having one or two crosslinkable functional groups introduced at one or both ends thereof, a liquid crystal polymer (LCP) or a liquid crystalline thermoset (LCT) oligomer, and an organic solvent. Therefore, the composition can be used as a material for next-generation boards that are becoming gradually lighter in weight and smaller in thickness and size. Further provided is a printed circuit board produced using the composition.

REFERENCES:
patent: 5167985 (1992-12-01), Ito et al.
patent: 7514126 (2009-04-01), Suemasu
patent: 2009/0092800 (2009-04-01), Yang et al.
patent: 11092647 (1999-04-01), None

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