Dual interface inlays

Details Dual interface inlays Dual interface inlays

2011-07-19

2011-07-19

Lee, Michael G (Department: 2876)

Registers

Records

Conductive

C235S488000, C343S873000, C343S895000, C340S572700, C029S600000

Reexamination Certificate

active

07980477

ABSTRACT:
A dual interface inlay having a bottom sheet; an antenna wire mounted to the top surface of the bottom sheet; end portions of the antenna wire formed with squiggles or meanders forming contact areas of increased surface area for subsequent attachment of a chip or chip module to the antenna wire; conductive material applied to the end portions of the antenna wire; a top sheet disposed over the bottom sheet for lamination thereto; and recesses formed in a bottom surface of the top sheet, at positions corresponding to the contact area. The antenna wire may be insulated wire, and insulation may be removed from the end portions of the antenna wire. Silicon cushions may be disposed in the bottom sheet under the contact areas.

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