Stacked chip-based system and method

Details Stacked chip-based system and method Stacked chip-based system and method

2011-04-26

2011-04-26

Warren, Matthew E (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Physical configuration of semiconductor

With electrical contact in hole in semiconductor

C257S698000, C257S777000, C257S778000, C257SE23011, C257SE23174

Reexamination Certificate

active

07932584

ABSTRACT:
A system has multiple discrete functional system subcomponents which, when interconnected form the system, each of the subcomponents being on a discrete substrate and being electrically interconnected to at least one of the other subcomponents by a through-chip via. A method of creating a system involves creating multiple discrete chips, each including at least one system subcomponent, forming electrically conductive vias in at least some of the chips such that some of the chips can be electrically connected to others of the chips, arranging the chips such that: some are coplanar in a first plane, at least one other lies in a second plane parallel to those in the first plane, and at least one of the chips in the first plane is connected to at least one of the chips in the second plane; and electrically interconnecting corresponding chips of the multiple discrete chips using the vias.

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