Methods of forming semiconductor structures

Details Methods of forming semiconductor structures Methods of forming semiconductor structures

2011-06-07

2011-06-07

Le, Dung A. (Department: 2818)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S622000, C438S637000, C438S638000, C438S639000

Reexamination Certificate

active

07955976

ABSTRACT:
The present invention relates to methods of forming semiconductor structures. The methods may include disposing electrically conductive material within an opening in a first dielectric material, passivating an upper surface of the electrically conductive material and introducing materials to form an interlayer dielectric upon the passivated upper surface. The present invention also includes methods of passivating surfaces of a semiconductor structure with a nitrogen-containing species.

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