Digital radiography imager with buried interconnect layer in...

Details Digital radiography imager with buried interconnect layer in... Digital radiography imager with buried interconnect layer in...

2011-05-24

2011-05-24

Nhu, David (Department: 2895)

Active solid-state devices (e.g., transistors, solid-state diode

Field effect device

Having insulated electrode

C257S288000, C257S347000, C257SE21170, C257SE21042, C257SE21051, C257SE21213, C257SE21247, C257SE21320, C257SE21370, C257SE21352, C257SE21692

Reexamination Certificate

active

07948017

ABSTRACT:
A method of forming an imaging array includes providing a single crystal silicon substrate having an internal separation layer, forming a patterned conductive layer proximate a first side of the single crystal silicon substrate, forming an electrically conductive layer on the first side of the single crystal silicon substrate and in communication with the patterned conductive layer, securing the single crystal silicon substrate having the patterned conductive layer and electrically conductive layer formed thereon to a glass substrate with the first side of the single crystal silicon substrate proximate the glass substrate, separating the single crystal silicon substrate at the internal separation layer to create an exposed surface opposite the first side of the single crystal silicon substrate and forming an array comprising a plurality of photosensitive elements and readout elements on the exposed surface.

REFERENCES:
patent: 4847210 (1989-07-01), Hwang et al.
patent: 5414276 (1995-05-01), McCarthy
patent: 5488012 (1996-01-01), McCarthy
patent: 6583030 (2003-06-01), Grassi
patent: 6610582 (2003-08-01), Stewart
patent: 6649977 (2003-11-01), McCarthy
patent: 6921961 (2005-07-01), Sanchez et al.
patent: 7075501 (2006-07-01), Spitzer et al.
patent: 7176528 (2007-02-01), Couillard et al.
patent: 7192844 (2007-03-01), Couillard et al.
patent: 7268051 (2007-09-01), Couillard et al.
patent: 7285477 (2007-10-01), Bernstein et al.

Affiliated with

Also associated with

Rating

Digital radiography imager with buried interconnect layer in... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Digital radiography imager with buried interconnect layer in..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Digital radiography imager with buried interconnect layer in... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2634645